Item | PCB Production Capability |
Base Material | Aluminium |
Layer | 1L |
Finished inner/outer cooper thickness | 1OZ |
Aluminum thickness | 1.6mm |
Thermal Conductivity | 2W/m.K |
Minimum Size | 1500mm 1layer |
Controlled Impedance | ±5% |
Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
Surface treatment | OSP |
Technical parameters and process capability of metal substarte(MCPCB) | |
ITEM | SPECIFICATION |
Surface | LF HASL,immersion gold,immersion siliver,OSP |
Layer | Single side,double sided Multilayer and special structure |
Maximum PCB size | 240mmx1490mm OR 490x1190mm |
PCB thickness | 0.4-3.0mm |
Copper Foil thickness | H 1/2/3/4(oz) |
Insulation layer thickness | 50/75/100/125/150/175/200(um) |
Metal Base thickness | AIuminum(1100/3003/5052/6061),Copper AIuminum |
Metal Base thickness | 0.5/0.8/1.0/1.2/1.6/2.0/3.2/5.0(mm) |
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