Item | PCB Production Capability |
Base Material | Aluminium |
Layer | 1L |
Finished inner/outer cooper thickness | 1OZ |
Aluminum thickness | 1.6mm |
Thermal Conductivity | 2W/m.K |
Minimum Size | 1500mm 1layer |
Controlled Impedance | ±5% |
Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
Surface treatment | OSP |
Technical parameters and process capability of metal substarte(MCPCB) | |
ITEM | SPECIFICATION |
Surface | LF HASL,immersion gold,immersion siliver,OSP |
Layer | Single side,double sided Multilayer and special structure |
Maximum PCB size | 240mmx1490mm OR 490x1190mm |
PCB thickness | 0.4-3.0mm |
Copper Foil thickness | H 1/2/3/4(oz) |
Insulation layer thickness | 50/75/100/125/150/175/200(um) |
Metal Base thickness | AIuminum(1100/3003/5052/6061),Copper AIuminum |
Metal Base thickness | 0.5/0.8/1.0/1.2/1.6/2.0/3.2/5.0(mm) |
Shaping | Die punching/CNC Route/V-Cut |
Test | 100% open&short test |
Shaping tolerance | Die Punching<+- 0.05mm,CNC Route<+-0.15mm,V-CUT Thick residue>+-0.15mm |
Hole tolerance | +-0.5mm |
Min.Hole DIameter | Single side 0.5/Double sided PTH0.3MM |
Solder mask | green/white/black/red/yellow |
Min.letter height | 0.8mm |
Min.line space | 0.15 |
Min.letter width | 0.15 |
Sile screen color | blue/white/black/red/yellow |
Sopecial hole | Spot facing/cup hole/buried via hole/buried tank |
File format | Gerber,Protel,PowerPCB,AutoCAD etc |
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